Kuleli phepha, izindlela zokwehluleka kanye nezindlela zokwehluleka kwezingxenye ze-elekthronikhi ziyafundwa futhi izindawo zazo ezibucayi zinikezwa ukuhlinzeka ngereferensi ethile yokuklama imikhiqizo ye-elekthronikhi.
1. Izindlela ezijwayelekile zokuhluleka kwengxenye
Inombolo yomkhiqizo
Igama lengxenye ye-elekthronikhi
Izindlela zokuhluleka ezihlobene nemvelo
Ukucindezeleka kwemvelo
1. Izingxenye ze-Electromechanical
Ukudlidliza kubangela ukukhathala ukuphuka kwamakhoyili kanye nokuxegiswa kwezintambo.
Ukudlidliza, ukushaqeka
2. Amadivayisi we-semiconductor microwave
Izinga lokushisa eliphezulu nokushaqeka kwezinga lokushisa kuholela ekwehleni kwesixhumi esibonakalayo phakathi kwempahla yephakeji ne-chip, naphakathi kwempahla yephakheji kanye nesixhumi esibonakalayo sesibambi se-chip se-monolith ye-microwave evalwe ngepulasitiki.
Ukushisa okuphezulu, ukushaqeka kwezinga lokushisa
3. Amasekhethi ahlanganisiwe ahlanganisiwe
Ukushaqeka kuholela ekuqhekekeni kwe-ceramic substrate, ukushaqeka kwezinga lokushisa kuholela ekuqhekekeni kokuphela kwe-electrode ye-capacitor, futhi izinga lokushisa lokuhamba ngebhayisikili liholela ekuhlulekeni kwe-solder.
Ukushaqeka, umjikelezo wezinga lokushisa
4. Amadivayisi Ahlukile kanye Neziyingi Ezihlanganisiwe
Ukuwohloka kwe-thermal, ukwehluleka kwe-chip soldering, ukwehluleka kokubopha umthofu wangaphakathi, ukushaqeka okuholela ekugqabukeni kongqimba lwe-passivation.
Izinga lokushisa eliphezulu, ukushaqeka, ukudlidliza
5. Izingxenye eziphikisayo
Ukuqhekeka kwe-substrate eyinhloko, ukuphuka kwefilimu ephikisayo, ukuphuka komthofu
Ukushaqeka, izinga lokushisa eliphezulu neliphansi
6. Isekhethi yezinga lebhodi
Amalunga e-solder aqhekekile, izimbobo zethusi eziphukile.
Izinga lokushisa eliphezulu
7. Ivacuum kagesi
Ukukhathala ukuphuka kocingo olushisayo.
Ukudlidliza
2, ukuhlaziya indlela yokwehluleka kwengxenye evamile
Imodi yokwehluleka yezingxenye ze-elekthronikhi ayiyona ingxenye eyodwa, kuphela ingxenye emele izingxenye ezijwayelekile zokuhlaziya umkhawulo wokubekezelela imvelo, ukuze uthole isiphetho esijwayelekile.
2.1 Izingxenye ze-Electromechanical
Izingxenye ezijwayelekile ze-electromechanical zihlanganisa izixhumi zikagesi, ama-relay, njll. Izindlela zokuhluleka zihlaziywa ngokujulile ngesakhiwo sezinhlobo ezimbili zezingxenye ngokulandelana kwazo.
1) Izixhumi zikagesi
Isixhumi sikagesi ngegobolondo, isivikelo kanye nendikimba yokuxhumana yamayunithi amathathu ayisisekelo, imodi yokwehluleka ifinyezwa ekuhlulekeni kokuxhumana, ukwehluleka kokufakwa ngaphakathi kanye nokwehluleka komshini kwezinhlobo ezintathu zokwehluleka.Ifomu eliyinhloko lokuhluleka kwesixhumi sikagesi ngokuhluleka kokuxhumana, ukwehluleka kokusebenza kwayo: ukuthintana ngekhefu elisheshayo kanye nokumelana nokuxhumana nokwanda.Izixhumi zikagesi, ngenxa yokuba khona kokumelana nokuxhumana nomqhubi wezinto ezibonakalayo, lapho kukhona ukugeleza kwamanje ngesixhumi sikagesi, ukumelana nokuxhumana nomshini wensimbi wensimbi kuzokhiqiza ukushisa kwe-Joule, ukushisa kwe-Joule kuzokwandisa ukushisa, okuholela ekwandeni kokushisa. izinga lokushisa lephuzu lokuxhumana, izinga lokushisa eliphakeme kakhulu lephuzu lokuxhumana lizokwenza indawo yokuxhumana yensimbi ithambe, incibilike noma ibilise, kodwa futhi ikhulise ukumelana nokuxhumana, ngaleyo ndlela ibangele ukwehluleka kokuxhumana..Endimeni yemvelo yokushisa okuphezulu, izingxenye zokuthintana nazo zizovela njenge-creep phenomenon, okwenza ingcindezi yokuxhumana phakathi kwezingxenye zokuthintana yehle.Lapho ukucindezela kokuxhumana kuncipha ngezinga elithile, ukumelana nokuxhumana kuzokhula kakhulu, futhi ekugcineni kubangele ukuthintana kukagesi okungalungile, okuholela ekuhlulekeni kokuxhumana.
Ngakolunye uhlangothi, isixhumi sikagesi esigciniwe, ezokuthutha kanye nomsebenzi, sizoba ngaphansi kwemithwalo ehlukahlukene yokudlidliza namandla omthelela, lapho imvamisa yokuvusa ukudlidliza kwangaphandle nezixhumi zikagesi eduze nemvamisa engokwemvelo, kuzokwenza ukuthi isixhumi sikagesi sibe ne-resonance. okwenzekayo, okuholela ekutheni igebe phakathi kwezingcezu zokuxhumana libe likhulu, igebe liyakhula ngezinga elithile, ingcindezi yokuxhumana izonyamalala ngaso leso sikhathi, okuholela ekuthinteni kukagesi "ikhefu elisheshayo".Ekudlidlizeni, umthwalo wokushaqeka, isixhumi sikagesi sizokhiqiza ukucindezeleka kwangaphakathi, lapho ukucindezeleka kudlula amandla okukhiqiza wezinto ezibonakalayo, kuzokwenza umonakalo wezinto ezibonakalayo nokuphuka;endimeni yalokhu ukucindezeleka isikhathi eside, impahla uyophinde kwenzeke umonakalo ukukhathala, futhi ekugcineni kubangele ukwehluleka.
2) Ukudluliselwa
Ama-electromagnetic relays ngokuvamile akhiwa ama-cores, amakhoyili, ama-armatures, abathintwayo, umhlanga nokunye.Inqobo nje uma i-voltage ethile yengezwa kuzo zombili iziphetho zekhoyili, i-current ethile izogeleza kukhoyili, ngaleyo ndlela ikhiqize umphumela we-electromagnetic, i-armature izonqoba amandla kazibuthe kagesi wokukhanga ukuze ibuyele ekudonselweni kwentwasahlobo kuya enkabeni, okuyinto yona ishayela othintana nabo abahambayo be-armature noxhumana nabo abamile (okuvamile okuvulayo oxhumana nabo) ukuthi bavale.Uma ikhoyili icishiwe, amandla okumunca i-electromagnetic nawo ayanyamalala, i-armature izobuyela endaweni yokuqala ngaphansi kwamandla okusabela entwasahlobo, ukuze okuthintayo okunyakazayo kanye nokuthintana okumile kwasekuqaleni (okuvame ukuvaleka ukuthintana).Lokhu kuncela nokukhululwa, ngaleyo ndlela kufezeke inhloso yokuqhuba nokunqanyulwa kumjikelezo.
Izindlela eziyinhloko zokwehluleka sekukonke kokudluliswa kwe-electromagnetic yilezi: i-relay ngokuvamile ivuliwe, i-relay ngokuvamile ivaliwe, isenzo sentwasahlobo esishukumisayo asihlangabezani nezidingo, ukuvalwa kokuxhumana ngemva kokuba amapharamitha kagesi adluliselwe edlula abampofu.Ngenxa yokushoda kwenqubo yokukhiqiza i-electromagnetic relay, ukwehluleka okuningi kwe-electromagnetic relay enqubweni yokukhiqiza ukubeka ikhwalithi yezingozi ezifihliwe, njengesikhathi sokukhulula ingcindezi ngomshini sifushane kakhulu okuholela ekwakhiweni komshini ngemuva kokuwohloka kwezingxenye zokubumba, ukususwa kwezinsalela akupheli. okuholela ekuhloleni kwe-PIND kuhlulekile noma ngisho nokwehluleka, ukuhlolwa kwasembonini kanye nokusetshenziswa kokuhlola akuqinile ukuze ukwehluleka kwedivayisi ukuthi isetshenziswe, njll.. Indawo yomthelela ingase ibangele ukuwohloka kwepulasitiki koxhumana nabo bensimbi, okuholela ekuhlulekeni kokudluliselwa kwedatha.Ekwakheni okokusebenza okuqukethe ama-relay, kuyadingeka ukuthi kugxilwe ekuguquguqukeni kwemvelo yomthelela okufanele kucatshangelwe.
2.2 Izingxenye ze-semiconductor ze-microwave
Amadivayisi we-semiconductor ye-Microwave ayizingxenye ezenziwe ngezinto ze-semiconductor ezihlanganisiwe ze-Ge, Si kanye ne-III ~ V ezisebenza kubhendi ye-microwave.Asetshenziswa ezintweni zikagesi ezifana ne-radar, izinhlelo ze-electronic warfare kanye nezinhlelo zokuxhumana ze-microwave.Ukupakishwa kwedivayisi ye-Microwave ehlukile ngaphezu kokuhlinzeka ngoxhumo lukagesi kanye nokuvikelwa kwemishini nekhemikhali kumongo namaphini, ukwakheka nokukhethwa kwendlu kufanele futhi kucabangele umthelela wamapharamitha we-parasitic wezindlu ezicini zokudlulisa i-microwave zocingo.Izindlu ze-microwave nazo ziyingxenye yesekethe, yona ngokwayo eyakha isekethe ephelele yokufaka nokuphumayo.Ngakho-ke, ukuma nokwakheka kwezindlu, usayizi, impahla ye-dielectric, ukumiswa komqhubi, njll. kufanele kuhambisane nezici ze-microwave zezingxenye kanye nezici zohlelo lokusebenza lwesekethe.Lezi zici zinquma imingcele efana ne-capacitance, ukumelana nomthofu kagesi, i-impedance yesici, nokulahlekelwa kwe-conductor kanye ne-dielectric yezindlu zamashubhu.
Izindlela zokwehluleka ezihambisana nemvelo nezindlela zezingxenye ze-semiconductor ye-microwave ikakhulukazi zifaka usinki wensimbi wesango kanye nokucekelwa phansi kwezakhiwo ezikwazi ukumelana nezimo.Usinki wensimbi wesango kungenxa yokusabalalisa okusheshisa ukushisa kwesango lensimbi (Au) kuma-GaAs, ngakho-ke le ndlela yokwehluleka kwenzeka ikakhulukazi phakathi nokuhlolwa kwempilo okusheshisiwe noma ukusebenza kwezinga lokushisa eliphakeme kakhulu.Izinga lokusatshalaliswa kwensimbi yesango (Au) kuma-GaAs liwumsebenzi we-coefficient yokusabalalisa yensimbi yesango, izinga lokushisa, kanye ne-gradient yokugxilisa impahla.Ngesakhiwo se-lattice esiphelele, ukusebenza kwedivayisi akuthintwa izinga lokusabalalisa elihamba kancane kakhulu kumazinga okushisa avamile okusebenza, nokho, izinga lokusabalalisa lingaba likhulu uma imingcele yezinhlayiyana mikhulu noma kunokushiyeka okuningi kwendawo.Ama-resistors avame ukusetshenziswa kumasekethe ahlanganisiwe e-microwave monolithic kumasekhethi empendulo, ukubeka iphuzu lokuchema lamadivayisi asebenzayo, ukuhlukaniswa, ukuhlanganiswa kwamandla noma ukuphela kokuhlangana, kunezinhlaka ezimbili zokumelana: ukumelana nefilimu yensimbi (i-TaN, i-NiCr) kanye nama-GaA afakwe kancane. ukumelana nongqimba oluncane.Ukuhlolwa kubonisa ukuthi ukuwohloka kokumelana kwe-NiCr okubangelwa umswakama kuyindlela eyinhloko yokwehluleka kwayo.
2.3 Amasekhethi ahlanganisiwe ahlanganisiwe
Imijikelezo ehlanganisiwe ye-hybrid yendabuko, ngokusho kobuso be-substrate ye-tape yomhlahlandlela wefilimu, inqubo ye-tape yomhlahlandlela wefilimu emincane ihlukaniswe izigaba ezimbili zamasekhethi ahlanganisiwe efilimu eyi-hybrid kanye namasekhethi ahlanganisiwe ahlanganisiwe wefilimu: ibhodi elincane eliphrintiwe (PCB) ngenxa yesifunda ephrintiwe isesimweni ifilimu endaweni flat ibhodi ukwakha iphethini conductive, futhi bahlukaniswa njengoba izifunda hybrid edidiyelwe.Ngokuvela kwezingxenye zama-multi-chip le sekethi edidiyelwe eyingxube ethuthukisiwe, i-substrate yayo eyingqayizivele ye-multi-layer ye-wiring kanye nobuchwepheshe benqubo ye-hole, yenze izingxenye zaba isifunda esihlanganisiwe esiyingxube esakhiweni esixhumene nesixhumo esiphezulu esifana ne-substrate esetshenzisiwe. ezingxenyeni ze-multi-chip futhi zifaka: i-multi-layer yefilimu emincane, i-multilayer yefilimu ewugqinsi, i-high-temperature co-fired, i-low-temperature co-fired, i-silicon-based, i-PCB multilayer substrate, njll.
Izindlela zokuhluleka kokucindezeleka kwezemvelo zesifunda esihlanganisiwe ngokuyinhloko zihlanganisa ukuhluleka kwesekethe evulekile kagesi okubangelwa ukuqhekeka kwe-substrate kanye nokwehluleka kwe-welding phakathi kwezingxenye kanye nama-conductor amafilimu aminyene, izingxenye kanye nama-conductor amafilimu amancane, i-substrate nezindlu.Umthelela wemishini ovela ekwehleni komkhiqizo, ukushaqeka okushisayo okuvela ekusebenzeni kwe-solder, ukucindezeleka okwengeziwe okubangelwa ukungalingani kwe-warpage ye-substrate, ukucindezeleka kwe-lateral tensile okuvela ekungafanini kokushisa phakathi kwe-substrate nezindlu zensimbi nezinto ezibophayo, ukucindezeleka komshini noma ukugxiliswa kokucindezeleka okushisayo okubangelwa ukukhubazeka kwangaphakathi kwe-substrate, umonakalo ongenzeka. okubangelwa ukubhola kwe-substrate kanye ne-substrate ukusika imifantu emincane yendawo, ekugcineni kuholele ekucindezelekeni komshini kwangaphandle okukhulu kunamandla emishini engokwemvelo ye-ceramic substrate okuthi Umphumela uba ukwehluleka.
Izakhiwo ze-Solder zithinteka ekucindezelekeni okuphindaphindiwe kokushisa kwamabhayisikili, okungaholela ekukhathaleni okushisayo kwesendlalelo se-solder, okuholela ekunciphiseni amandla okubopha kanye nokwanda kokumelana nokushisa.Ekilasini elisekelwe ku-tin le-ductile solder, indima yokushisa kwe-cyclic stress iholela ekukhathaleni okushisayo kwesendlalelo se-solder kungenxa ye-coefficient yokwandisa okushisayo kwezakhiwo ezimbili ezixhunywe yi-solder ayihambisani, i-solder displacement deformation noma ukuguqulwa kwe-shear, ngemva kokuphindaphindiwe, isendlalelo se-solder ngokukhathala ukunwetshwa nokunwetshwa, ekugcineni kuholele ekuhlulekeni kokukhathala kwesendlalelo se-solder.
2.4 Amadivayisi ahlukene kanye namasekhethi ahlanganisiwe
Amadivayisi ahlukene we-Semiconductor ahlukaniswe abe ama-diode, ama-bipolar transistors, amashubhu womphumela wensimu we-MOS, ama-thyristors kanye nama-transistors wesango ahlanganisiwe we-bipolar ngezigaba ezibanzi.Amasekhethi ahlanganisiwe anohlu olubanzi lwezinhlelo zokusebenza futhi angahlukaniswa abe izigaba ezintathu ngokwemisebenzi yawo, okungamasekhethi adidiyelwe edijithali, amasekhethi ahlanganisiwe e-analog kanye namasekethe ahlanganisiwe edijithali-analogi.
1) Amadivayisi ahlukene
Amadivayisi ahlukahlukene ayizinhlobo ezahlukahlukene futhi anokucaciswa kwawo ngenxa yemisebenzi yawo ehlukene nezinqubo, anomehluko omkhulu ekusebenzeni kokwehluleka.Kodwa-ke, njengamadivayisi ayisisekelo akhiwa izinqubo ze-semiconductor, kukhona ukufana okuthile ku-physics yabo yokuhluleka.Ukwehluleka okuyinhloko okuhlobene nemishini yangaphandle kanye nemvelo yemvelo ukuwohloka kokushisa, i-avalanche eguqukayo, ukwehluleka kwe-chip soldering kanye nokwehluleka kwangaphakathi kokubopha umthofu.
Ukuwohloka kokushisa: Ukuwohloka kokushisa noma ukuwohloka kwesibili kuyindlela yokwehluleka eyinhloko ethinta izingxenye zamandla e-semiconductor, futhi umonakalo omkhulu ngesikhathi sokusetshenziswa uhlobene nesenzakalo sesibili sokuphuka.Ukuhlukaniswa kwesibili kuhlukaniswe ukuhlukaniswa kwesibili okuchemile okuya phambili kanye nokuhlehlisa ukuhlehla kwesibili okuchema.Eyokuqala ihlobene kakhulu nezici zokushisa zedivayisi, njengokugxiliswa kwe-doping yedivayisi, ukugxilisa ingqondo kwangaphakathi, njll., kuyilapho lokhu kwakamuva kuhlobene nokuphindaphindeka kwe-avalanche yezinkampani zenethiwekhi endaweni yokushaja isikhala (njengaseduze nesiqoqi), kokubili. ezihlala zihambisana nokugcwala kwamandla ngaphakathi kwedivayisi.Ekusetshenzisweni kwezingxenye ezinjalo, ukunakwa okukhethekile kufanele kukhokhwe ekuvikelweni kokushisa nokushisa kokushisa.
I-avalanche enamandla: Ngesikhathi sokuvalwa okuguquguqukayo ngenxa yamandla angaphandle noma angaphakathi, into elawulwa njengamanje yokushayisana kwe-ionization eyenzeka ngaphakathi kwedivayisi ethonywe ukugxiliswa kwenkampani yenethiwekhi yamahhala ibangela i-avalanche eguquguqukayo, engenzeka kumadivayisi e-bipolar, ama-diode nama-IGBT.
Ukuhluleka kwe-Chip solder: Isizathu esiyinhloko ukuthi i-chip kanye ne-solder yizinto ezihlukene ezinama-coefficients ahlukene wokunweba okushisayo, ngakho-ke kukhona ukungafani kokushisa emazingeni okushisa aphezulu.Ngaphezu kwalokho, ukuba khona kwe-solder voids kwandisa ukumelana nokushisa kwedivayisi, okwenza ukuchithwa kokushisa kube kubi kakhulu futhi kwakha izindawo ezishisayo endaweni yendawo, kuphakamisa izinga lokushisa le-junction futhi kubangele ukwehluleka okuhlobene nokushisa okufana nokuhamba kwe-electromigration.
Ukwehluleka kwesibopho somthofu wangaphakathi: ikakhulukazi ukwehluleka ukugqwala endaweni yokubopha, okubangelwa ukugqwala kwe-aluminium okubangelwa isenzo somhwamuko wamanzi, izakhi ze-chlorine, njll. endaweni eshisayo neswakeme kasawoti.Ukukhathala kokuphuka kwe-aluminium bonding kuholela okubangelwa umjikelezo wezinga lokushisa noma ukudlidliza.I-IGBT kuphakheji yemojula inkulu ngosayizi, futhi uma ifakwe ngendlela engafanele, kulula kakhulu ukubangela ukuhlushwa kokucindezeleka, okuholela ekuqhekekeni kokukhathala kwemikhondo yangaphakathi yemodyuli.
2) Isifunda esihlanganisiwe
Indlela ehlulekayo yamasekhethi ahlanganisiwe kanye nokusetshenziswa kwemvelo inobudlelwano obukhulu, umswakama endaweni enomswakama, umonakalo odalwe ugesi omile noma ukushisa kukagesi, ukusetshenziswa okuphezulu kakhulu kombhalo kanye nokusetshenziswa kwamasekhethi ahlanganisiwe endaweni ekhipha imisebe ngaphandle kwemisebe. ukuqinisa ukumelana nakho kungabangela ukwehluleka kwedivayisi.
Imiphumela ye-interface ehlobene ne-aluminium: Kumadivayisi kagesi anezinto ezisekelwe ku-silicon, ungqimba lwe-SiO2 njengefilimu ye-dielectric isetshenziswa kabanzi, futhi i-aluminium ivame ukusetshenziswa njengento yokuxhuma imigqa, i-SiO2 ne-aluminium emazingeni okushisa aphezulu kuyoba ukusabela kwamakhemikhali, ukuze ungqimba lwe-aluminium lube mncane, uma ungqimba lwe-SiO2 luqedwa ngenxa yokusetshenziswa kokusabela, luzokwenza ukuthintana okuqondile phakathi kwe-aluminium ne-silicon.Ngaphezu kwalokho, intambo yegolide eholayo kanye nolayini wokuxhumanisa we-aluminium noma intambo yebhondi ye-aluminium kanye nokubopha intambo eholayo efakwe igolide yegobolondo leshubhu, kuzokhiqiza ukuthintana kwe-Au-Al.Ngenxa yamandla ahlukene amakhemikhali alezi zinsimbi ezimbili, ngemva kokusetshenziswa isikhathi eside noma ukugcinwa emazingeni okushisa angaphezu kuka-200 ℃ kuzokhiqiza izinhlanganisela ezihlukahlukene ze-intermetallic, futhi ngenxa yokungaguquguquki kwe-lattice kanye nama-coefficients okwandisa okushisayo ahlukene, endaweni yokuhlanganisa ngaphakathi. ukucindezeleka okukhulu, i-conductivity iba mncane.
Ukugqwala kwe-Metallization: Ulayini wokuxhuma i-aluminium ku-chip usengozini yokugqwala ngenxa yomhwamuko wamanzi endaweni eshisayo neswakeme.Ngenxa yokwehla kwentengo nokukhiqizwa kwenqwaba okulula, amasekethe amaningi ahlanganisiwe ambozwe nge-resin, nokho, umhwamuko wamanzi ungadlula ku-resin ukuze ufinyelele ekuxhumekeni kwe-aluminium, nokungcola okulethwa ngaphandle noma okuncibilikisiwe esenzweni se-resin nge-aluminium yensimbi ukuze kubangele. ukugqwala kwezixhumi ze-aluminium.
Umthelela we-delamination obangelwa umhwamuko wamanzi: ipulasitiki IC iyisekethe ehlanganisiwe embozwe ngepulasitiki nezinye izinto ze-resin polymer, ngaphezu komphumela we-delamination phakathi kwezinto zepulasitiki kanye nohlaka lwensimbi ne-chip (eyaziwa kakhulu ngokuthi "i-popcorn") ngenxa yokuthi impahla ye-resin inezici zokungeniswa komhwamuko wamanzi, umphumela we-delamination obangelwa ukufakwa komhwamuko wamanzi nawo uzobangela ukuthi idivayisi ihluleke..Indlela yokwehluleka ukunwetshwa okusheshayo kwamanzi kumpahla yokuvala uphawu epulasitiki emazingeni okushisa aphezulu, ukuze ukuhlukaniswa phakathi kwepulasitiki nokunamathiselwe kwayo kwezinye izinto, futhi ezimeni ezibucayi, umzimba wokuvala uphawu wepulasitiki uzoqhuma.
2.5 Izingxenye ze-Capacitive resistive
1) Abaphikisi
Ama-resistors avamile angewona ama-winding angahlukaniswa abe yizinhlobo ezine ngokuya ngezinto ezihlukene ezisetshenziswa emzimbeni we-resistor, okungukuthi uhlobo lwe-alloy, uhlobo lwefilimu, uhlobo lwefilimu eliwugqinsi kanye nohlobo lokwenziwa.Kuma-resistors ahleliwe, izindlela eziyinhloko zokuhluleka ziyisekethe evulekile, ipharamitha yepharamitha kagesi, njll.;kuyilapho kuma-potentiometers, izindlela eziyinhloko zokuhluleka ziyisekethe evulekile, ipharamitha yepharamitha kagesi, ukwanda komsindo, njll. Indawo yokusetshenziswa izophinde iholele ekugugeni kwe-resistor, okunomthelela omkhulu empilweni yemishini kagesi.
I-Oxidation: I-oxidation ye-resistor body izonyusa inani lokumelana futhi iyisici esibaluleke kakhulu esibangela ukuguga kwe-resistor.Ngaphandle kwemizimba ephikisayo eyenziwe ngezinsimbi eziyigugu nama-alloys, zonke ezinye izinto zizolinyazwa umoya-mpilo osemoyeni.I-oxidation ingumphumela wesikhathi eside, futhi lapho umthelela wezinye izici uncipha kancane kancane, i-oxidation izoba yinto eyinhloko, futhi izinga lokushisa eliphezulu kanye nezindawo ezinomswakama ophezulu kuzosheshisa ukuxutshwa kwe-resistors.Kuzinto eziphikisa ukunemba nezimelana nenani eliphakeme, isilinganiso esibalulekile sokuvimbela i-oxidation ukuvikela ukuvala uphawu.Izinto zokuvala kufanele kube izinto ezingaphili, njengensimbi, i-ceramic, ingilazi, njll. Ungqimba oluvikelayo lwemvelo alukwazi ukuvimbela ngokuphelele ukungena komswakama kanye nokungena komoya, futhi lungadlala indima yokubambezeleka kuphela ekufakweni kwe-oxidation nasekukhangiseni.
Ukuguga kwe-binder: Ku-organic synthetic resistors, ukuguga kwe-organic binder kuyisici esiyinhloko esithinta ukuzinza kwe-resistor.I-organic binder ngokuyinhloko iyinhlaka yokwenziwa, eguqulwa ibe i-polymerized thermosetting polymer ngokwelashwa okushisayo phakathi nenqubo yokukhiqiza yesiphikisa.Isici esiyinhloko esidala ukuguga kwe-polymer i-oxidation.Ama-radicals amahhala akhiqizwa i-oxidation adala ukulenga kwe-polymer molecular bond, okuqhubeka nokwelapha i-polymer futhi kuyenze ibe brittle, okuholela ekulahlekelweni kokunwebeka kanye nokulimala kwemishini.Ukuphulukiswa kwe-binder kubangela ukuthi i-resistor iyancipha ngevolumu, ikhulise ingcindezi yokuxhumana phakathi kwezinhlayiya ze-conductive futhi inciphise ukumelana nokuxhumana, okuholela ekwehleni kokumelana, kodwa ukulimala komshini ku-binder nakho kwandisa ukumelana.Ngokuvamile ukuphulukiswa kwe-binder kwenzeka ngaphambili, ukulimala komshini kwenzeka ngemva, ngakho-ke inani lokumelana lezinto eziphilayo zokwenziwa kwe-organic resistors libonisa iphethini elandelayo: ukwehla okunye ekuqaleni kwesiteji, bese kuphenduka ukwanda, futhi kukhona umkhuba wokwanda.Njengoba ukuguga kwama-polymers kuhlobene eduze nezinga lokushisa nokukhanya, izithasiselo zokwenziwa zizosheshisa ukuguga ngaphansi kwemvelo yokushisa okuphezulu kanye nokuchayeka kokukhanya okuqinile.
Ukuguga ngaphansi komthwalo kagesi: Ukufaka umthwalo ku-resistor kuzosheshisa inqubo yokuguga.Ngaphansi komthwalo we-DC, isenzo se-electrolytic singalimaza izinqamuleli zefilimu ezizacile.I-Electrolysis yenzeka phakathi kwezikhala ze-slotted resistor, futhi uma i-resistor substrate iyimpahla ye-ceramic noma yengilazi equkethe ama-ion ensimbi e-alkali, ama-ion ahamba ngaphansi kwesenzo senkambu kagesi phakathi kwezikhala.Endaweni enomswakama, le nqubo iqhubeka ngobudlova.
2) Ama-Capacitors
Izindlela zokwehluleka kwama-capacitor ukujikeleza okufushane, isekethe evulekile, ukuwohloka kwamapharamitha kagesi (okuhlanganisa nokushintsha kwamandla, ukwanda kwe-angle yokulahleka kwe-tangent nokuncipha kokumelana nokufakwa kwe-insulation), ukuvuza kwe-liquid kanye nokuphuka kokugqwala komthofu.
Isifunda esifushane: I-arc endizayo emaphethelweni phakathi kwezigxobo ekushiseni okuphezulu kanye nokucindezela komoya okuphansi kuzoholela kumjikelezo omfushane wama-capacitor, ngaphezu kwalokho, ukucindezeleka komshini njengokushaqeka kwangaphandle kuzophinde kubangele isifunda esifushane se-dielectric.
Isekhethi evulekile: Ukufakwa kwe-oxidation kwezintambo zomthofu kanye nokuxhumana kwama-electrode okubangelwa indawo enomswakama neshisayo, okuholela ekungafinyelelekini kwezinga eliphansi kanye nokuphuka kokugqwala kwe-anode lead foil.
Ukuwohloka kwamapharamitha kagesi: Ukuwohloka kwamapharamitha kagesi ngenxa yethonya lendawo enomswakama.
2.6 Ukujikeleza kwezinga lebhodi
Ibhodi lesifunda ephrintiwe ikakhulukazi yakhiwa substrate insulating, izintambo zensimbi futhi oxhumanisa izingqimba ezahlukene izintambo, solder izingxenye "pads".Indima yayo eyinhloko ukuhlinzeka ngomthwali wezingxenye ze-elekthronikhi, kanye nokudlala indima yokuxhuma ngogesi kanye nemishini.
Imodi yokwehluleka kwebhodi lesifunda eliphrintiwe ngokuyinhloko ihlanganisa ukusoda okungekuhle, ukuvuleka nokujikeleza okufushane, amabhamuza, ukuqhuma kwebhodi le-delamination, ukugqwala kwendawo yebhodi noma ukuguquguquka kombala, ukugoba kwebhodi
Isikhathi sokuthumela: Nov-21-2022